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Fine Pitch Probe, Ø0.16 mm (16.00 mm) - PB028TA1600B-33A

Our longest fine pitch probe. It reaches through thick probe card substrates and multi-layer fixture stacks. The Ø0.16 mm plunger handles QFN, LGA, and fine-pitch BGA packages where the Ø0.10 mm variants run too small.

Longitud total Diámetro del émbolo Resistencia de contacto Rango de temperatura Durabilidad Corriente Nominal Fuerza de resorte Carrera de trabajo Carrera completa
16.00 ±0.15 mm Ø0.16 mm ≤100 mΩ −40°C a 80°C ≥100.000 ciclos 1.0 A 33 gf ±20% 2.60 mm 4.32 mm
Especificación Detalles
Longitud total16.00 ±0.15 mm
Diámetro del émboloØ0.16 mm
Resistencia de contacto≤100 mΩ
Rango de temperatura−40°C a 80°C
Durabilidad≥100.000 ciclos
Corriente Nominal1.0 A
Fuerza de resorte33 gf ±20%
Carrera de trabajo2.60 mm
Carrera completa4.32 mm

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Fine Pitch Probe, Ø0.10 mm (6.10 mm) - PB028B610B-30A

This probe delivers the longest cycle life in the fine pitch range at 200,000+ insertions, paired with contact resistance at or below 100 mΩ. A strong fit for high-volume semiconductor final test and burn-in sockets where frequent probe swaps drive up fixture cost.

Longitud total Diámetro del émbolo Resistencia de contacto Rango de temperatura Durabilidad Corriente Nominal Fuerza de resorte Carrera de trabajo Carrera completa
6.10 ±0.15 mm Ø0.10 mm ≤100 mΩ Sin especificar ≥200,000 ciclos 1.0 A 30 gf ±20% 0.70 mm 1.00 mm
Especificación Detalles
Longitud total6.10 ±0.15 mm
Diámetro del émboloØ0.10 mm
Resistencia de contacto≤100 mΩ
Rango de temperaturaSin especificar
Durabilidad≥200,000 ciclos
Corriente Nominal1.0 A
Fuerza de resorte30 gf ±20%
Carrera de trabajo0.70 mm
Carrera completa1.00 mm

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Fine Pitch Probe, Ø0.10 mm (2.40 mm) - PB020F240B-12B

Our shortest fine pitch probe. It fits wafer-level probe cards and WLCSP test sockets where Z-axis clearance is minimal and pads are delicate.

Longitud total Diámetro del émbolo Resistencia de contacto Rango de temperatura Durabilidad Corriente Nominal Fuerza de resorte Carrera de trabajo Carrera completa
2.40 ±0.12 mm Ø0.10 mm Avg ≤200 mΩ −40°C to 125°C ≥50,000 cycles 0.2 A 12.8 gf ±20% (working) / 15.3 gf ±20% (full) 0.35 mm 0.45 mm
Especificación Detalles
Longitud total2.40 ±0.12 mm
Diámetro del émboloØ0.10 mm
Resistencia de contactoAvg ≤200 mΩ
Rango de temperatura−40°C to 125°C
Durabilidad≥50,000 cycles
Corriente Nominal0.2 A
Fuerza de resorte12.8 gf ±20% (working) / 15.3 gf ±20% (full)
Carrera de trabajo0.35 mm
Carrera completa0.45 mm

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How to Choose the Right Fine Pitch Probe

how to choose the right fine pitch probe

  1. Start with your package pitch. Identify the minimum pad-to-pad pitch on your Device Under Test (DUT). WLCSP and ultra-fine BGA packages at 0.30–0.40 mm pitch need the Ø0.10 mm probes. QFN, LGA, and standard fine-pitch BGA packages at 0.40–1.00 mm pitch work with the Ø0.16 mm PB028TA1600B-33A. If your pitch exceeds 1.00 mm, consider our single-end or double-end probe ranges instead.
  2. Match probe length to your test socket or probe card stack. The PB020F240B-12B at 2.40 mm fits ultra-thin wafer-level probe cards. The PB028B610B-30A at 6.10 mm suits standard-height IC test sockets. The PB028TA1600B-33A at 16.00 mm reaches through thicker multi-layer fixture assemblies. The working stroke determines how much mechanical tolerance the probe absorbs. The PB028TA1600B-33A provides 2.60 mm of working stroke, over seven times the PB020F240B-12B’s 0.35 mm.
  3. Establece tu límite de resistencia de contacto. The PB028B610B-30A and PB028TA1600B-33A hold at or below 100 mΩ. That suits parametric measurement and continuity testing. The PB020F240B-12B averages below 200 mΩ, which works for go/no-go continuity checks. Keep this in mind if your test program includes precision analog measurements.
  4. Factor cycle life against your production volume. The PB028B610B-30A at 200,000+ cycles targets high-volume semiconductor final test where probe replacement drives fixture operating cost. The PB028TA1600B-33A at 100,000 cycles suits medium-volume production. Reserve the PB020F240B-12B at 50,000 cycles for wafer-level validation and lower-volume qualification programs.
  5. Check your target pad or bump material. Solder bumps on WLCSP devices need tip shapes that penetrate oxide without smearing solder across adjacent pads. Gold-plated pads on LGA packages need a gentler contact profile to avoid scratch damage. Promax offers crown, spear, and flat tip geometries. Specify your DUT pad material and finish when requesting a quote so we can match the right tip.
  6. ¿No estás seguro? Habla con nuestros ingenieros. Send us your package drawing and test socket specification. Our team of 20+ dedicated engineers respond within 1–3 days with a probe recommendation and free sample timeline.

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Confianza de ingenieros de pruebas en todas las industrias

Semiconductor / Wafer-Level Testing

We run 3,200 Ø0.10 mm Promax probes per wafer sort card at 0.35 mm pitch on a WLCSP product line. After 300,000+ touchdowns, the tip geometry still holds, with no visible deformation or solder smear on adjacent pads. Contact resistance drift stayed within 15% of initial values across the full run. First-pass yield on our sort program improved by 1.8% after switching from our previous probe vendor, which more than offset the qualification cycle.

Senior Probe Card Engineer,

Semiconductor OSAT, Penang, Malaysia

Consumer Electronics / WLCSP Final Test

We replaced probes every 60,000 cycles on our previous final test sockets. The PB028B610B-30A pushed that interval past 200,000 cycles with stable contact resistance throughout. On a line running 18,000 units per day, the reduction in probe swaps cut our annual socket maintenance cost by roughly 40%. Throughput improved too, because we stopped losing two hours of test time per changeover.

Test Engineering Manager,

Consumer Electronics Contract Manufacturer, Shenzhen, China

Automotive / Sensor IC Testing

Our sensor ICs use 0.50 mm pitch QFN packages and go through AEC-Q100 qualification, so the test probes face thermal cycling from −40°C to 125°C across every lot. The Promax fine pitch probes held contact resistance within spec through the full qualification sequence and into volume production. We logged over 80,000 insertions on the same set of probes without a single out-of-spec resistance reading. That kind of stability matters when your test data feeds directly into PPAP documentation.

Test Fixture Engineer,

Automotive Semiconductor Supplier, Munich, Germany

Fine Pitch Probes FAQs

What pitch can fine pitch probes support?

Fine pitch probes support test point pitches from 0.30 mm to 1.00 mm. The Ø0.10 mm barrel diameter fits pitches down to 0.30 mm for WLCSP and ultra-fine BGA packages. The Ø0.16 mm barrel covers 0.40 mm to 1.00 mm pitches for QFN, LGA, and standard fine-pitch BGA devices.

What is the difference between fine pitch probes and standard test probes?

Fine pitch probes use barrel diameters of Ø0.16 mm or smaller. That lets them fit pad pitches below 1.00 mm where standard probes with Ø0.40 mm+ barrels cannot physically fit. They also apply lower spring forces, typically 12–33 gf, to prevent damage to the smaller and more fragile pads found on fine-pitch IC packages.

Which IC package types work with fine pitch probes?

Fine pitch probes are designed for BGA, WLCSP, QFN, LGA, and Chip Scale Package (CSP) devices. Crown tip shapes suit solder bumps on BGA and WLCSP devices. Spear and needle tips suit flat pads on QFN and LGA packages. Specify your package type and pad material when requesting a quote.

How long do fine pitch probes last in a production test socket?

Cycle life ranges from 50,000 to 200,000+ insertions, depending on the model. The PB028B610B-30A achieves the highest rating in the range at 200,000+ cycles, targeting high-volume semiconductor final test. The PB020F240B-12B is rated at 50,000 cycles for wafer-level probe card applications where shorter probe life is offset by lower per-probe cost.

Can I get fine pitch probes with custom tip geometry?

Yes, our engineers design custom tip profiles matched to your specific DUT pad material and geometry. Options include crown, spear, flat, and needle tips, along with custom plating materials optimized for the pad finish on your device. Send your package drawing, and our team provides a design recommendation within 1–3 business days.

What is the lead time for custom fine pitch probes?

Entregamos muestras de prototipos dentro de las dos semanas posteriores a la confirmación del diseño. Los pedidos de producción en masa se envían dentro de 3 a 4 semanas. La revisión de ingeniería de su especificación comienza dentro de 1 a 3 días hábiles de su presentación.

What certifications does Promax hold for fine pitch probe manufacturing?

Contamos con las certificaciones ISO 9001, ISO 14001, ISO 45001 e IECQ QC080000. Nuestra planta de producción mantiene un rendimiento de producción en serie superior al 99,1 % en más de 8.000 diseños personalizados entregados a clientes como Huawei, Xiaomi y Amphenol.

¿Ofrecen muestras gratuitas para pruebas de calificación?

Yes, we provide free samples so you can validate fit, contact resistance, and mechanical compatibility in your test socket or probe card before committing to production. Standard catalog configurations ship within two weeks. Custom samples may take additional time depending on design complexity.

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