ISO 9001, ISO 14001, ISO 45001, and IECQ QC080000
Over 15 Years of Expertise
FREE samples provided to ensure product satisfaction
Rapid Turnaround: Mass Production Complete in 15 - 20 Days
Ultra-fine plunger IC test probe for high-density semiconductor packages. At 0.15 mm plunger diameter, it’s built for fine-pitch BGA and QFP test sockets where space between pads is tight. Contact resistance stays below 100 mΩ across 100,000+ test cycles.
| Overall Length | Plunger Diameter Ø | Rated Current | Contact Resistance | Spring Force | Working Stroke | Temperature Range | Durability |
|---|---|---|---|---|---|---|---|
| 5.70 ±0.15 mm | 0.15 ±0.01 mm | 1.0A | ≤100 mΩ | 35 gf ±20% | 1.00 mm full, 0.65 mm working | −40°F–302°F | ≥100,000 cycles |
| Specification | Details |
|---|---|
| Overall Length | 5.70 ±0.15 mm |
| Plunger Diameter Ø | 0.15 ±0.01 mm |
| Rated Current | 1.0A |
| Contact Resistance | ≤100 mΩ |
| Spring Force | 35 gf ±20% |
| Working Stroke | 1.00 mm full, 0.65 mm working |
| Temperature Range | −40°F–302°F |
| Durability | ≥100,000 cycles |
